- ball bonding
- (термокомпрессионная) сварка "шариком"
English-Russian dictionary of computer science and programming. 2013.
ball bonding
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Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… … Wikipedia
ball bonding — rutulinis termokompresinis suvirinimas statusas T sritis radioelektronika atitikmenys: angl. ball bonding; nail head bonding; thermocompression ball bonding vok. Nagelkopfbondverfahren, n; Nailheadbonding, n; Thermokompressionskugelbonden, n rus … Radioelektronikos terminų žodynas
thermocompression ball bonding — rutulinis termokompresinis suvirinimas statusas T sritis radioelektronika atitikmenys: angl. ball bonding; nail head bonding; thermocompression ball bonding vok. Nagelkopfbondverfahren, n; Nailheadbonding, n; Thermokompressionskugelbonden, n rus … Radioelektronikos terminų žodynas
gold ball bonding — rutulinis termokompresinis aukso vielos prijungimas statusas T sritis radioelektronika atitikmenys: angl. gold ball bonding vok. Goldnagelkopfbonden, n rus. шариковое термокомпрессионное присоединение золотой проволоки, n pranc. thermocompression … Radioelektronikos terminų žodynas
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Ball screw — A ball screw is a mechanical device for translating rotational motion to linear motion. A threaded shaft provides a spiral raceway for ball bearings which act as a precision screw. As well as being able to apply or withstand high thrust loads… … Wikipedia
ball clay — noun Etymology: from its formation into balls for transport from the mines : a very plastic high firing clay that fires white to light buff and is used especially to give plasticity to clayware bodies containing short clays * * * Ceram. a fine… … Useful english dictionary
ball clay — Ceram. a fine dark kaolinic clay that turns white or nearly white when fired, used in the manufacture of a wide variety of ceramic wares in combination with other clays for its exceptional bonding properties and plasticity. [1805 15] * * * … Universalium
Wire bonding — is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.The wire is generally made up of one of the following: *Gold *Aluminum *CopperWire diameters start at 15 µm and can be up … Wikipedia
nail-head bonding — rutulinis termokompresinis suvirinimas statusas T sritis radioelektronika atitikmenys: angl. ball bonding; nail head bonding; thermocompression ball bonding vok. Nagelkopfbondverfahren, n; Nailheadbonding, n; Thermokompressionskugelbonden, n rus … Radioelektronikos terminų žodynas
Wire bonding — es el método más usado para llevar a cabo las conexiones entre los circuitos integrados y la placa de circuito impreso (PCB). Sin embargo, la utilidad del método wire bonding no se limita sólo a este tipo de conexiones, ya que también se puede… … Wikipedia Español
